CVE-2016-2063

Severity: high (CVSS 7.8 v3.1)
Exploited in the wild: not listed in CISA KEV
EPSS: 0.5% probability of exploitation in the next 30 days
Public exploit or detection template: none known
Published: 2016-08-07 · updated 2026-06-17
Weakness: CWE-119

Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

Affected products

Linux kernel: from 3.0 through 3.19.8

References

http://www.securityfocus.com/bid/92381
https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4
https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063
http://www.securityfocus.com/bid/92381
https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4
https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063

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