What’s Vulnerable › Vulnerabilities

CVE-2017-18157

• Severity: high (CVSS 7.8 v3.0)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.2% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2019-05-06 · updated 2026-06-17
• Weakness: CWE-416

Description

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Affected products

• Qualcomm Mdm9206 Firmware: all versions
• Qualcomm Mdm9607 Firmware: all versions
• Qualcomm Mdm9650 Firmware: all versions
• Qualcomm Msm8909W Firmware: all versions
• Qualcomm Msm8996Au Firmware: all versions
• Qualcomm Sd 205 Firmware: all versions
• Qualcomm Sd 210 Firmware: all versions
• Qualcomm Sd 212 Firmware: all versions
• Qualcomm Sd 415 Firmware: all versions
• Qualcomm Sd 425 Firmware: all versions
• Qualcomm Sd 450 Firmware: all versions
• Qualcomm Sd 615 Firmware: all versions
• Qualcomm Sd 616 Firmware: all versions
• Qualcomm Sd 625 Firmware: all versions
• Qualcomm Sd 650 Firmware: all versions
• Qualcomm Sd 652 Firmware: all versions
• Qualcomm Sd 820 Firmware: all versions
• Qualcomm Sd 820A Firmware: all versions
• Qualcomm Sd 835 Firmware: all versions
• Qualcomm Sd 845 Firmware: all versions
• Qualcomm Sdx20 Firmware: all versions

References

• https://www.qualcomm.com/company/product-security/bulletins
• https://www.qualcomm.com/company/product-security/bulletins

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