What’s Vulnerable › Vulnerabilities

CVE-2017-18173

• Severity: high (CVSS 7.8 v3.0)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.2% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2019-05-06 · updated 2026-06-17
• Weakness: CWE-190

Description

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.

Affected products

• Qualcomm Sd 425 Firmware: all versions
• Qualcomm Sd 427 Firmware: all versions
• Qualcomm Sd 430 Firmware: all versions
• Qualcomm Sd 435 Firmware: all versions
• Qualcomm Sd 450 Firmware: all versions
• Qualcomm Sd 625 Firmware: all versions
• Qualcomm Sd 810 Firmware: all versions
• Qualcomm Sd 820 Firmware: all versions
• Qualcomm Sd 835 Firmware: all versions
• Qualcomm Sdm630 Firmware: all versions
• Qualcomm Sdm636 Firmware: all versions
• Qualcomm Sdm660 Firmware: all versions
• Qualcomm Snapdragon High Med 2016 Firmware: all versions

References

• https://www.qualcomm.com/company/product-security/bulletins
• https://www.qualcomm.com/company/product-security/bulletins

Get alerted when CVE-2017-18173 or the next vulnerability affects your stack