What’s Vulnerable › Vulnerabilities

CVE-2017-18274

• Severity: high (CVSS 7.8 v3.0)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.2% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2019-05-06 · updated 2026-06-17
• Weakness: CWE-129

Description

While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835

Affected products

• Qualcomm Mdm9206 Firmware: all versions
• Qualcomm Mdm9607 Firmware: all versions
• Qualcomm Mdm9650 Firmware: all versions
• Qualcomm Sd 205 Firmware: all versions
• Qualcomm Sd 210 Firmware: all versions
• Qualcomm Sd 212 Firmware: all versions
• Qualcomm Sd 425 Firmware: all versions
• Qualcomm Sd 430 Firmware: all versions
• Qualcomm Sd 450 Firmware: all versions
• Qualcomm Sd 617 Firmware: all versions
• Qualcomm Sd 625 Firmware: all versions
• Qualcomm Sd 650 Firmware: all versions
• Qualcomm Sd 652 Firmware: all versions
• Qualcomm Sd 820 Firmware: all versions
• Qualcomm Sd 820A Firmware: all versions
• Qualcomm Sd 835 Firmware: all versions

References

• https://www.qualcomm.com/company/product-security/bulletins
• https://www.qualcomm.com/company/product-security/bulletins

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