What’s Vulnerable › Vulnerabilities

CVE-2017-18295

• Severity: high (CVSS 7.8 v3.0)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.3% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2018-10-23 · updated 2026-06-17
• Weakness: CWE-119

Description

Possible buffer overflow if input is not null terminated in DSP Service module in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20.

Affected products

• Qualcomm Mdm9206 Firmware: all versions
• Qualcomm Mdm9607 Firmware: all versions
• Qualcomm Mdm9650 Firmware: all versions
• Qualcomm Msm8909W Firmware: all versions
• Qualcomm Msm8996Au Firmware: all versions
• Qualcomm Sd 205 Firmware: all versions
• Qualcomm Sd 210 Firmware: all versions
• Qualcomm Sd 212 Firmware: all versions
• Qualcomm Sd 415 Firmware: all versions
• Qualcomm Sd 450 Firmware: all versions
• Qualcomm Sd 615 Firmware: all versions
• Qualcomm Sd 616 Firmware: all versions
• Qualcomm Sd 625 Firmware: all versions
• Qualcomm Sd 650 Firmware: all versions
• Qualcomm Sd 652 Firmware: all versions
• Qualcomm Sd 820 Firmware: all versions
• Qualcomm Sd 820A Firmware: all versions
• Qualcomm Sd 835 Firmware: all versions
• Qualcomm Sdx20 Firmware: all versions

References

• http://www.securitytracker.com/id/1041432
• https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
• https://www.qualcomm.com/company/product-security/bulletins
• http://www.securitytracker.com/id/1041432
• https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
• https://www.qualcomm.com/company/product-security/bulletins

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