What’s Vulnerable › Vulnerabilities

CVE-2017-18305

• Severity: high (CVSS 7.0 v3.0)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.2% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2018-10-23 · updated 2026-06-17

Description

XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.

Affected products

• Qualcomm Mdm9206 Firmware: all versions
• Qualcomm Mdm9607 Firmware: all versions
• Qualcomm Mdm9650 Firmware: all versions
• Qualcomm Sd 205 Firmware: all versions
• Qualcomm Sd 210 Firmware: all versions
• Qualcomm Sd 212 Firmware: all versions
• Qualcomm Sd 835 Firmware: all versions

References

• http://www.securitytracker.com/id/1041432
• https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
• https://www.qualcomm.com/company/product-security/bulletins
• http://www.securitytracker.com/id/1041432
• https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
• https://www.qualcomm.com/company/product-security/bulletins

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