What’s Vulnerable › Vulnerabilities

CVE-2017-18313

• Severity: medium (CVSS 5.3 v3.0)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.3% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2018-10-23 · updated 2026-06-17

Description

Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.

Affected products

• Qualcomm Msm8909W Firmware: all versions
• Qualcomm Sd 205 Firmware: all versions
• Qualcomm Sd 210 Firmware: all versions
• Qualcomm Sd 212 Firmware: all versions
• Qualcomm Sd 410 Firmware: all versions
• Qualcomm Sd 412 Firmware: all versions
• Qualcomm Sd 415 Firmware: all versions
• Qualcomm Sd 615 Firmware: all versions
• Qualcomm Sd 616 Firmware: all versions
• Qualcomm Sd 617 Firmware: all versions

References

• https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components
• https://www.qualcomm.com/company/product-security/bulletins
• https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components
• https://www.qualcomm.com/company/product-security/bulletins

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