What’s Vulnerable › Vulnerabilities

CVE-2018-11264

• Severity: high (CVSS 7.8 v3.0)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.2% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2018-11-28 · updated 2026-06-17
• Weakness: CWE-119

Description

Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.

Affected products

• Qualcomm Mdm9206 Firmware: all versions
• Qualcomm Mdm9607 Firmware: all versions
• Qualcomm Mdm9650 Firmware: all versions
• Qualcomm Msm8996Au Firmware: all versions
• Qualcomm Sd 205 Firmware: all versions
• Qualcomm Sd 210 Firmware: all versions
• Qualcomm Sd 212 Firmware: all versions
• Qualcomm Sd 410 Firmware: all versions
• Qualcomm Sd 412 Firmware: all versions
• Qualcomm Sd 425 Firmware: all versions
• Qualcomm Sd 430 Firmware: all versions
• Qualcomm Sd 450 Firmware: all versions
• Qualcomm Sd 625 Firmware: all versions
• Qualcomm Sd 650 Firmware: all versions
• Qualcomm Sd 652 Firmware: all versions
• Qualcomm Sd 820 Firmware: all versions
• Qualcomm Sd 820A Firmware: all versions
• Qualcomm Sd 835 Firmware: all versions
• Qualcomm Sda660 Firmware: all versions

References

• http://www.securityfocus.com/bid/105838
• https://www.qualcomm.com/company/product-security/bulletins
• http://www.securityfocus.com/bid/105838
• https://www.qualcomm.com/company/product-security/bulletins

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