What’s Vulnerable › Vulnerabilities

CVE-2018-11277

• Severity: high (CVSS 7.8 v3.0)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.2% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2018-09-20 · updated 2026-06-17
• Weakness: CWE-732

Description

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

Affected products

• Qualcomm Msm8909W Firmware: all versions
• Qualcomm Msm8996Au Firmware: all versions
• Qualcomm Sd205 Firmware: all versions
• Qualcomm Sd210 Firmware: all versions
• Qualcomm Sd212 Firmware: all versions
• Qualcomm Sd415 Firmware: all versions
• Qualcomm Sd430 Firmware: all versions
• Qualcomm Sd450 Firmware: all versions
• Qualcomm Sd615 Firmware: all versions
• Qualcomm Sd616 Firmware: all versions
• Qualcomm Sd617 Firmware: all versions
• Qualcomm Sd625 Firmware: all versions
• Qualcomm Sd650 Firmware: all versions
• Qualcomm Sd652 Firmware: all versions
• Qualcomm Sd810 Firmware: all versions
• Qualcomm Sd820 Firmware: all versions
• Qualcomm Sd820A Firmware: all versions
• Qualcomm Sd835 Firmware: all versions
• Qualcomm Sd845 Firmware: all versions
• Qualcomm Sda660 Firmware: all versions

References

• https://www.qualcomm.com/company/product-security/bulletins
• https://www.qualcomm.com/company/product-security/bulletins

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