What’s Vulnerable › Vulnerabilities

CVE-2018-5878

• Severity: critical (CVSS 9.8 v3.0)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.9% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2018-07-06 · updated 2026-06-17
• Weakness: CWE-119

Description

While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.

Affected products

• Qualcomm Mdm9206 Firmware: all versions
• Qualcomm Mdm9607 Firmware: all versions
• Qualcomm Mdm9635M Firmware: all versions
• Qualcomm Mdm9650 Firmware: all versions
• Qualcomm Sd 205 Firmware: all versions
• Qualcomm Sd 210 Firmware: all versions
• Qualcomm Sd 212 Firmware: all versions
• Qualcomm Sd 415 Firmware: all versions
• Qualcomm Sd 615 Firmware: all versions
• Qualcomm Sd 616 Firmware: all versions
• Qualcomm Sd 625 Firmware: all versions
• Qualcomm Sd 835 Firmware: all versions

References

• https://www.qualcomm.com/company/product-security/bulletins
• https://www.qualcomm.com/company/product-security/bulletins

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