What’s Vulnerable › Vulnerabilities

CVE-2018-5892

• Severity: high (CVSS 7.5 v3.0)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.8% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2018-07-06 · updated 2026-06-17
• Weakness: CWE-200

Description

The Touch Pal application can collect user behavior data without awareness by the user in Snapdragon Mobile and Snapdragon Wear.

Affected products

• Qualcomm Mdm9206 Firmware: all versions
• Qualcomm Mdm9607 Firmware: all versions
• Qualcomm Mdm9650 Firmware: all versions
• Qualcomm Msm8996Au Firmware: all versions
• Qualcomm Sd 205 Firmware: all versions
• Qualcomm Sd 210 Firmware: all versions
• Qualcomm Sd 212 Firmware: all versions
• Qualcomm Sd 415 Firmware: all versions
• Qualcomm Sd 425 Firmware: all versions
• Qualcomm Sd 427 Firmware: all versions
• Qualcomm Sd 430 Firmware: all versions
• Qualcomm Sd 435 Firmware: all versions
• Qualcomm Sd 450 Firmware: all versions
• Qualcomm Sd 615 Firmware: all versions
• Qualcomm Sd 616 Firmware: all versions
• Qualcomm Sd 625 Firmware: all versions
• Qualcomm Sd 650 Firmware: all versions
• Qualcomm Sd 652 Firmware: all versions
• Qualcomm Sd 810 Firmware: all versions
• Qualcomm Sd 820 Firmware: all versions
• Qualcomm Sd 835 Firmware: all versions
• Qualcomm Sd 845 Firmware: all versions
• Qualcomm Sdm630 Firmware: all versions
• Qualcomm Sdm636 Firmware: all versions
• Qualcomm Sdm660 Firmware: all versions
• Qualcomm Sdm710 Firmware: all versions
• Qualcomm Snapdragon High Med 2016 Firmware: all versions

References

• https://www.qualcomm.com/company/product-security/bulletins
• https://www.qualcomm.com/company/product-security/bulletins

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