What’s Vulnerable › Vulnerabilities

CVE-2019-10625

• Severity: high (CVSS 7.1 v3.1)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.2% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2020-04-16 · updated 2026-06-17
• Weakness: CWE-125

Description

Out of bound access in diag services when DCI command buffer reallocation is not done properly with required capacity in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCS605, Rennell, SC8180X, SDM429W, SDM710, SDX55, SM7150, SM8150

Affected products

• Qualcomm Apq8009 Firmware: all versions
• Qualcomm Apq8096Au Firmware: all versions
• Qualcomm Mdm9206 Firmware: all versions
• Qualcomm Mdm9207C Firmware: all versions
• Qualcomm Mdm9607 Firmware: all versions
• Qualcomm Mdm9640 Firmware: all versions
• Qualcomm Mdm9650 Firmware: all versions
• Qualcomm Qcs605 Firmware: all versions
• Qualcomm Rennell Firmware: all versions
• Qualcomm Sc8180X Firmware: all versions
• Qualcomm Sdm429W Firmware: all versions
• Qualcomm Sdm710 Firmware: all versions
• Qualcomm Sdx55 Firmware: all versions
• Qualcomm Sm7150 Firmware: all versions
• Qualcomm Sm8150 Firmware: all versions

References

• https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin
• https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin

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