CVE-2019-14030

Severity: high (CVSS 7.8 v3.1)
Exploited in the wild: not listed in CISA KEV
EPSS: 0.2% probability of exploitation in the next 30 days
Public exploit or detection template: none known
Published: 2020-03-05 · updated 2026-06-17
Weakness: CWE-120

Description

The size of a buffer is determined by addition and multiplications operations that have the potential to overflow due to lack of bound check in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, Rennell, SC8180X, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130

Affected products

Qualcomm Mdm9205 Firmware: all versions
Qualcomm Qcs404 Firmware: all versions
Qualcomm Rennell Firmware: all versions
Qualcomm Sc8180X Firmware: all versions
Qualcomm Sdm845 Firmware: all versions
Qualcomm Sdm850 Firmware: all versions
Qualcomm Sdx55 Firmware: all versions
Qualcomm Sm6150 Firmware: all versions
Qualcomm Sm7150 Firmware: all versions
Qualcomm Sm8150 Firmware: all versions
Qualcomm Sm8250 Firmware: all versions
Qualcomm Sxr2130 Firmware: all versions

References

https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin
https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin

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