What’s Vulnerable › Vulnerabilities

CVE-2019-17517

• Severity: medium (CVSS 5.7 v3.1)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.6% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2020-02-10 · updated 2026-06-17
• Weakness: CWE-120

Description

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet.

Affected products

• Dialog-Semiconductor Software Development Kit: through 5.0.4

References

• https://asset-group.github.io/disclosures/sweyntooth/
• https://www.dialog-semiconductor.com/products/connectivity/bluetooth-low-energy/smartbond-da14580-and-da14583
• https://asset-group.github.io/disclosures/sweyntooth/
• https://www.dialog-semiconductor.com/products/connectivity/bluetooth-low-energy/smartbond-da14580-and-da14583

Get alerted when CVE-2019-17517 or the next vulnerability affects your stack