What’s Vulnerable › Vulnerabilities

CVE-2019-17518

• Severity: medium (CVSS 6.5 v3.1)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.8% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2020-02-10 · updated 2026-06-17
• Weakness: CWE-120

Description

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, August Smart Lock.

Affected products

• Dialog-Semiconductor Software Development Kit: through 1.0.14.1081

References

• https://asset-group.github.io/disclosures/sweyntooth/
• https://www.dialog-semiconductor.com/ja/products/connectivity/bluetooth-low-energy/smartbond-da14680-and-da14681
• https://asset-group.github.io/disclosures/sweyntooth/
• https://www.dialog-semiconductor.com/ja/products/connectivity/bluetooth-low-energy/smartbond-da14680-and-da14681

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