What’s Vulnerable › Vulnerabilities

CVE-2019-19196

• Severity: medium (CVSS 6.5 v3.1)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 1.4% probability of exploitation in the next 30 days
• Public exploit or detection template: yes
• Published: 2020-02-12 · updated 2026-06-17
• Weakness: CWE-120

Description

The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.

Affected products

• Telink-Semi Tlsr8232 Ble Sdk: through 1.3.0
• Telink-Semi Tlsr8251 Ble Sdk: through 3.4.0
• Telink-Semi Tlsr8253 Ble Sdk: through 3.4.0
• Telink-Semi Tlsr8258 Ble Sdk: through 3.4.0
• Telink-Semi Tlsr8269 Ble Sdk: through 3.3

References

• http://www.telink-semi.com/ble
• https://asset-group.github.io/disclosures/sweyntooth/
• http://www.telink-semi.com/ble
• https://asset-group.github.io/disclosures/sweyntooth/

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