What’s Vulnerable › Vulnerabilities

CVE-2019-2266

• Severity: high (CVSS 7.8 v3.1)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.2% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2019-11-21 · updated 2026-06-17
• Weakness: CWE-415

Description

Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150

Affected products

• Qualcomm Apq8053 Firmware: all versions
• Qualcomm Ipq4019 Firmware: all versions
• Qualcomm Ipq8064 Firmware: all versions
• Qualcomm Mdm9206 Firmware: all versions
• Qualcomm Mdm9207C Firmware: all versions
• Qualcomm Mdm9607 Firmware: all versions
• Qualcomm Msm8909 Firmware: all versions
• Qualcomm Msm8909W Firmware: all versions
• Qualcomm Nicobar Firmware: all versions
• Qualcomm Qca9980 Firmware: all versions
• Qualcomm Qcs405 Firmware: all versions
• Qualcomm Qcs605 Firmware: all versions
• Qualcomm Sdm845 Firmware: all versions
• Qualcomm Sdx24 Firmware: all versions
• Qualcomm Sm7150 Firmware: all versions
• Qualcomm Sm8150 Firmware: all versions

References

• https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin
• https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin

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