CVE-2020-11154

Severity: high (CVSS 8.8 v3.1)
Exploited in the wild: not listed in CISA KEV
EPSS: 0.5% probability of exploitation in the next 30 days
Public exploit or detection template: none known
Published: 2020-11-02 · updated 2026-06-17
Weakness: CWE-120

Description

u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55

Affected products

Qualcomm Apq8009 Firmware: all versions
Qualcomm Apq8053 Firmware: all versions
Qualcomm Qca6390 Firmware: all versions
Qualcomm Qcn7605 Firmware: all versions
Qualcomm Qcn7606 Firmware: all versions
Qualcomm Sa415M Firmware: all versions
Qualcomm Sa515M Firmware: all versions
Qualcomm Sa6155P Firmware: all versions
Qualcomm Sa8155P Firmware: all versions
Qualcomm Sc8180X Firmware: all versions
Qualcomm Sdx55 Firmware: all versions

References

https://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletin
https://www.qualcomm.com/company/product-security/bulletins/october-2020-security-bulletin
https://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletin

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