What’s Vulnerable › Vulnerabilities
CVE-2020-11155
- Severity: high (CVSS 8.8 v3.1)
- Exploited in the wild: not listed in CISA KEV
- EPSS: 0.5% probability of exploitation in the next 30 days
- Public exploit or detection template: none known
- Published: 2020-11-02 · updated 2026-06-17
- Weakness: CWE-120
Description
u'Buffer overflow while processing PDU packet in bluetooth due to lack of check of buffer length before copying into it.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55
Affected products
- Qualcomm Apq8009 Firmware: all versions
- Qualcomm Apq8053 Firmware: all versions
- Qualcomm Qca6390 Firmware: all versions
- Qualcomm Qcn7605 Firmware: all versions
- Qualcomm Qcn7606 Firmware: all versions
- Qualcomm Sa415M Firmware: all versions
- Qualcomm Sa515M Firmware: all versions
- Qualcomm Sa6155P Firmware: all versions
- Qualcomm Sa8155P Firmware: all versions
- Qualcomm Sc8180X Firmware: all versions
- Qualcomm Sdx55 Firmware: all versions
References
- https://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletin
- https://www.qualcomm.com/company/product-security/bulletins/october-2020-security-bulletin
- https://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletin
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