What’s Vulnerable › Vulnerabilities

CVE-2022-22090

• Severity: high (CVSS 7.8 v3.1)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.2% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2022-06-14 · updated 2026-06-17
• Weakness: CWE-416

Description

Memory corruption in audio due to use after free while managing buffers from internal cache in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile

Affected products

• Qualcomm Sd865 5G Firmware: all versions
• Qualcomm Sd888 5G Firmware: all versions
• Qualcomm Sd 8 Gen1 5G Firmware: all versions
• Qualcomm Sdx65 Firmware: all versions
• Qualcomm Sm7450 Firmware: all versions
• Qualcomm Sm8475 Firmware: all versions
• Qualcomm Sm8475P Firmware: all versions
• Qualcomm Wcd9370 Firmware: all versions
• Qualcomm Wcd9375 Firmware: all versions
• Qualcomm Wcd9380 Firmware: all versions
• Qualcomm Wcd9385 Firmware: all versions
• Qualcomm Wcn6750 Firmware: all versions
• Qualcomm Wcn6850 Firmware: all versions
• Qualcomm Wcn6851 Firmware: all versions
• Qualcomm Wcn6855 Firmware: all versions
• Qualcomm Wcn6856 Firmware: all versions
• Qualcomm Wcn7850 Firmware: all versions
• Qualcomm Wcn7851 Firmware: all versions
• Qualcomm Wsa8810 Firmware: all versions
• Qualcomm Wsa8815 Firmware: all versions
• Qualcomm Wsa8830 Firmware: all versions
• Qualcomm Wsa8832 Firmware: all versions
• Qualcomm Wsa8835 Firmware: all versions

References

• https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin
• https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin

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