What’s Vulnerable › Vulnerabilities

CVE-2023-21671: Improper Input Validation in Core

• Severity: high (CVSS 7.8 v3.1)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.1% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2023-11-07 · updated 2026-06-17
• Weakness: CWE-20

Description

Memory Corruption in Core during syscall for Sectools Fuse comparison feature.

Affected products

• Qualcomm Fastconnect 6700 Firmware: all versions
• Qualcomm Fastconnect 6900 Firmware: all versions
• Qualcomm Qca6391 Firmware: all versions
• Qualcomm Qcm6490 Firmware: all versions
• Qualcomm Qcs6490 Firmware: all versions
• Qualcomm Qsm8350 Firmware: all versions
• Qualcomm Sd888 Firmware: all versions
• Qualcomm Sm7315 Firmware: all versions
• Qualcomm Sm7325P Firmware: all versions
• Qualcomm Snapdragon 778G+ 5G Mobile Platform Firmware: all versions
• Qualcomm Snapdragon 778G 5G Mobile Platform Firmware: all versions
• Qualcomm Snapdragon 780G 5G Mobile Platform Firmware: all versions
• Qualcomm Snapdragon 782G Mobile Platform Firmware: all versions
• Qualcomm Snapdragon 7C+ Gen 3 Compute Firmware: all versions
• Qualcomm Snapdragon 888+ 5G Mobile Platform Firmware: all versions
• Qualcomm Snapdragon 888 5G Mobile Platform Firmware: all versions
• Qualcomm Video Collaboration Vc3 Platform Firmware: all versions
• Qualcomm Wcd9370 Firmware: all versions
• Qualcomm Wcd9375 Firmware: all versions
• Qualcomm Wcd9380 Firmware: all versions
• Qualcomm Wcd9385 Firmware: all versions
• Qualcomm Wcn6740 Firmware: all versions
• Qualcomm Wsa8830 Firmware: all versions
• Qualcomm Wsa8835 Firmware: all versions

References

• https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin
• https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin

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