What’s Vulnerable › Vulnerabilities

CVE-2026-21372: Heap-Based Buffer Overflow in Power Management IC

• Severity: high (CVSS 7.8 v3.1)
• Exploited in the wild: not listed in CISA KEV
• EPSS: 0.1% probability of exploitation in the next 30 days
• Public exploit or detection template: none known
• Published: 2026-04-06 · updated 2026-10-25
• Weakness: CWE-122

Description

Memory Corruption when sending IOCTL requests with invalid buffer sizes during memcpy operations.

Affected products

• Qualcomm Cologne Firmware: all versions
• Qualcomm Fastconnect 6700 Firmware: all versions
• Qualcomm Fastconnect 6900 Firmware: all versions
• Qualcomm Fastconnect 7800 Firmware: all versions
• Qualcomm Qcm5430 Firmware: all versions
• Qualcomm Qcm6490 Firmware: all versions
• Qualcomm Snapdragon 460 Mobile Platform Firmware: all versions
• Qualcomm Snapdragon 662 Mobile Platform Firmware: all versions
• Qualcomm Snapdragon 7C+ Gen 3 Compute Firmware: all versions
• Qualcomm Video Collaboration Vc3 Platform Firmware: all versions
• Qualcomm Wcd9370 Firmware: all versions
• Qualcomm Wcd9375 Firmware: all versions
• Qualcomm Wcd9378C Firmware: all versions
• Qualcomm Wcd9380 Firmware: all versions
• Qualcomm Wcd9385 Firmware: all versions
• Qualcomm Wcn3950 Firmware: all versions
• Qualcomm Wcn3988 Firmware: all versions
• Qualcomm Wsa8840 Firmware: all versions
• Qualcomm Wsa8845 Firmware: all versions
• Qualcomm Wsa8845H Firmware: all versions
• Qualcomm X2000077 Firmware: all versions
• Qualcomm X2000086 Firmware: all versions
• Qualcomm X2000090 Firmware: all versions
• Qualcomm X2000092 Firmware: all versions
• Qualcomm X2000094 Firmware: all versions
• Qualcomm Xg101002 Firmware: all versions
• Qualcomm Xg101032 Firmware: all versions
• Qualcomm Xg101039 Firmware: all versions

References

• https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2026-bulletin.html

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